169 kelvin cryogenic microcooler employing a condenser, evaporator, flow restriction and counterflow heat exchangers

Author

Burger, J. ; Holland, H. ; Berenschot, E. ; Seppenwoolde, J.-H. ; ter Brake, M. ; Gardeniers, H. ; Elwenspoek, M.

Author_Institution

MESA Res. Inst., Twente Univ., Enschede, Netherlands

fYear

2001

fDate

25-25 Jan. 2001

Firstpage

418

Lastpage

421

Abstract

This paper presents the first cryogenic micromachined cooler that is suitable to cool from ambient temperature to 169 kelvin and below. The cooler operates with the vapor compression cycle. It consists of a silicon micromachined condenser, a flow restriction/evaporator and two miniature glass-tube counterflow heat exchangers, which are integrated with the silicon components using a novel gluing technique. The system was tested with ethylene gas from 20 to 1 bar, and produces a cooling power of 200 mW at 169 K with a mass flow of 0.5 mg/s.

Keywords

cooling; cryogenic electronics; heat exchangers; integrated circuit packaging; micromachining; microvalves; superconducting integrated circuits; 20 to 1 bar; 200 mW; 293 to 169 K; Si; cooling power; counterflow heat exchangers; cryogenic microcooler; evaporator; flow restriction; gluing technique; mass flow; micromachined condenser; vapor compression cycle; Cooling; Cryogenics; Erbium; Kelvin; Low-noise amplifiers; Silicon; Steel; System testing; Temperature; Valves;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on

Conference_Location

Interlaken, Switzerland

ISSN

1084-6999

Print_ISBN

0-7803-5998-4

Type

conf

DOI

10.1109/MEMSYS.2001.906567

Filename

906567