DocumentCode :
2916762
Title :
Implantable parylene-based wireless intraocular pressure sensor
Author :
Chen, Po-Jui ; Rodger, Damien C. ; Saati, Saloomeh ; Humayun, Mark S. ; Tai, Yu-Chong
Author_Institution :
California Inst. of Technol., Pasadena
fYear :
2008
fDate :
13-17 Jan. 2008
Firstpage :
58
Lastpage :
61
Abstract :
This paper presents a novel implantable, wireless, passive pressure sensor for ophthalmic applications. Two sensor designs incorporating surface-micromachined variable capacitor and variable capacitor/inductor are implemented to realize the pressure sensitive components. The sensor is monolithically microfabricated using parylene as a biocompatible structural material in a suitable form factor for increased ease of intraocular implantation. Pressure responses of the microsensor are characterized on-chip to demonstrate its high pressure sensitivity (> 7000 ppm/mmHg) with mmHg level resolution. An in vivo animal study verifies the biostability of the sensor implant in the intraocular environment after more than 150 days. This sensor will ultimately be implanted at the pars plana or iris of the eye to fulfill continuous intraocular pressure (IOP) monitoring in glaucoma patients.
Keywords :
biomedical equipment; biomedical measurement; capacitive sensors; diseases; eye; micromachining; microsensors; patient monitoring; pressure sensors; biocompatible structural material; continuous intraocular pressure monitoring; glaucoma patients; implantable wireless passive pressure sensor; in vivo animal study; microsensor; monolithical microfabrication; parylene-based sensor; surface-micromachined variable capacitor; Animals; Biological materials; Biosensors; Capacitive sensors; Capacitors; Implants; Inductors; Microsensors; Sensor phenomena and characterization; Wireless sensor networks;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
Conference_Location :
Tucson, AZ
ISSN :
1084-6999
Print_ISBN :
978-1-4244-1792-6
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2008.4443592
Filename :
4443592
Link To Document :
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