Title :
Efficient time-domain modeling of lumped circuits in quasiperiodic behavior
Author :
Iordache, M. ; Dumitriu, Lucia ; Mandache, L.
Author_Institution :
Politeh. Univ. of Bucharest, Bucharest, Romania
Abstract :
It is commonly accepted that the most accurate analysis methods of lumped circuits are based on time-domain algorithms. If the circuit behavior is quasiperiodic, as in the case of several electronic equipment (e.g. communications, medicine or audio-video technology), the required computational effort may become unacceptable. This is caused by the extremely small time steps (imposed by the fastest component of the signals) relative to the total simulation time (related to the slowest component). A new and valuable alternative is based on the Multitime Partial Differential Equation approach which preserves the analysis accuracy with a reasonably computational effort. Although the concept was described in the literature, only few applications have been practically treated. This paper overcomes this reality and presents a general algorithm for time-domain modeling of lumped linear or nonlinear circuits in quasiperiodic behavior, based on the MPDE approach. A complete example is given, using our new dedicated program, accompanied by a common SPICE simulation, for comparison.
Keywords :
lumped parameter networks; network synthesis; partial differential equations; time-domain analysis; SPICE simulation; lumped circuits; multitime partial differential equation; quasiperiodic behavior; time-domain modeling; Algorithm design and analysis; Circuit simulation; Computational modeling; Electronic equipment; Frequency; Medical simulation; Nonlinear circuits; Partial differential equations; SPICE; Time domain analysis; Quasiperiodic signal; circuit modeling; computational effort; warped partial differential equation approach;
Conference_Titel :
Digital Signal Processing, 2009 16th International Conference on
Conference_Location :
Santorini-Hellas
Print_ISBN :
978-1-4244-3297-4
Electronic_ISBN :
978-1-4244-3298-1
DOI :
10.1109/ICDSP.2009.5201094