DocumentCode :
2916908
Title :
A novel double-side CMOS-MEMS post processing for monolithic sensor integration
Author :
Sun, Chih-Ming ; Wang, Chuanwei ; Tsai, Ming-Han ; Hsie, Hsieh-Shen ; Fang, Weileun
Author_Institution :
Nanoengineering & Microsystem Inst., Hsinchu
fYear :
2008
fDate :
13-17 Jan. 2008
Firstpage :
90
Lastpage :
93
Abstract :
This study presents a novel double-side CMOS post-process to monolithically integrate various capacitance type CMOS sensors on a single chip. In applications, the pressure sensor and linear accelerometer have been realized and monolithic integrated using the TSMC 2P4M process and the present post-process. The measurement results show that sensitivities (non-linearity) of the pressure sensor and the accelerometer are 12 mV/kPa (4.77%), and 3.9 mV/G (1.06%), respectively. The measurement ranges are 0~10 kPa, and 0.3~6 G, respectively.
Keywords :
CMOS integrated circuits; accelerometers; capacitive sensors; microsensors; pressure sensors; TSMC 2P4M process; capacitance type CMOS sensors; double-side CMOS-MEMS post processing; linear accelerometer; monolithic sensor integration; pressure 0 kPa to 10 kPa; pressure sensor; Accelerometers; CMOS process; Capacitance; Chemical sensors; Dielectric substrates; Electrodes; Etching; Gas detectors; Intelligent sensors; Micromechanical devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
Conference_Location :
Tucson, AZ
ISSN :
1084-6999
Print_ISBN :
978-1-4244-1792-6
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2008.4443600
Filename :
4443600
Link To Document :
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