Implantable RF-coiled chip packaging

Author

Li, W. ; Rodger, D.C. ; Tai, Y.C.

Author_Institution

California Inst. of Technol., Pasadena

fYear

2008

fDate

13-17 Jan. 2008

Firstpage

108

Lastpage

111

Abstract

In this paper, we present an embedded chip integration technology that utilizes silicon housings and flexible parylene radio frequency (RF) coils. As a demonstration of this technology, a flexible parylene RF coil has been integrated with an RF identification (RFID) chip. The coil has an inductance of 16 muH, with two layers of metal completely encapsulated in parylene-C. The functionality of the embedded chip is verified using an RFID reader module. Accelerated-lifetime soak testing has been performed in saline, and the results show that the silicon chip is well protected and the lifetime of our parylene-encapsulated RF coil at 37degC is more than 20 years.

Keywords

coils; integrated circuit packaging; integrated circuit testing; radiofrequency identification; radiofrequency integrated circuits; RF identification chip; accelerated-lifetime soak testing; embedded chip integration technology; flexible parylene radio frequency coils; implantable RF-coiled chip packaging; parylene-C; silicon chip; silicon housings; temperature 37 C; Coils; Inductance; Life estimation; Life testing; Packaging; Performance evaluation; Protection; Radio frequency; Radiofrequency identification; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on

Conference_Location

Tucson, AZ

ISSN

1084-6999

Print_ISBN

978-1-4244-1792-6

Electronic_ISBN

1084-6999

Type

conf

DOI

10.1109/MEMSYS.2008.4443604

Filename

4443604