DocumentCode
2917206
Title
Basic study of brain injury mechanism
Author
Saito, S. ; Kato, K. ; Yamada, T. ; Kurosawa, Y. ; Shindo, Y. ; Kubo, M. ; Takahashi, H. ; Uzuka, T. ; Fujii, Y.
Author_Institution
Dept. of Mech. Eng. Inf., Meiji Univ., Kawasaki, Japan
fYear
2010
fDate
Aug. 31 2010-Sept. 4 2010
Firstpage
528
Lastpage
531
Abstract
The purpose of this study is to discuss the mechanism of brain injury experimentally paying attention to the pressure changes on the surface of a brain agar phantom generated by a cavitation. In this paper, first, an experimental system for performing an simple impact experiment is presented. A simple human head model consists of a skull, cerebrospinal fluid (CSF) and brain tissue, represented by acrylic resin, water and agar, respectively. Second, we measured the pressure changes on the surface of the brain agar phantom during impact. We also observed the behavior of the simple head model using a high-speed camera. From the photographs taken by the high-speed camera, we confirmed that cavitation bubbles occurred at the contrecoup side. And the surface of the brain agar phantom at the contrecoup side was also destroyed. From these results, the destruction of the surface of the brain agar phantom at the contrecoup side, during impact is caused by pressure changes generated by the cavitation.
Keywords
biomechanics; brain; cavitation; impact (mechanical); injuries; neurophysiology; phantoms; pressure measurement; CSF; acrylic resin; brain agar phantom; brain injury mechanism; brain surface pressure changes; brain tissue; cavitation; cerebrospinal fluid; high speed camera; high speed photographs; human head model; impact experiment; skull; water; Brain injuries; Brain modeling; Cameras; Finite element methods; Phantoms; Pressure measurement; Agar; Biomechanics; Biomedical Research; Brain; Brain Injuries; Head; Humans; Models, Biological; Photography; Pressure;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2010 Annual International Conference of the IEEE
Conference_Location
Buenos Aires
ISSN
1557-170X
Print_ISBN
978-1-4244-4123-5
Type
conf
DOI
10.1109/IEMBS.2010.5626042
Filename
5626042
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