Modeling the influence of etching defects on the sensitivity of MEMS convective accelerometers

Author

Rekik, A.A. ; Azais, F. ; Dumas, N. ; Mailly, F. ; Nouet, P.

Author_Institution

LIRMM - CNRS, Univ. Montpellier 2, Montpellier, France

fYear

2010

fDate

7-9 June 2010

Firstpage

1

Lastpage

6

Abstract

In this paper, a behavioral model that includes the influence of etching defects on the sensitivity of MEMS convective accelerometers is presented. Starting from an existing behavioral model, new physically-based expressions have been derived to introduce etching defects in the simulation of thermal conduction in the sensor. In addition, a semi-empirical model has been introduced for thermal convection. Finally, a very good agreement is obtained between the behavioral model and FEM simulations.

Keywords

accelerometers; convection; finite element analysis; heat conduction; microsensors; FEM simulations; MEMS convective accelerometers; behavioral model; etching defects; semiempirical model; thermal conduction; thermal convection; Accelerometers; Electrical fault detection; Electrical resistance measurement; Etching; Micromechanical devices; System testing; Temperature sensors; Thermal resistance; Virtual manufacturing; Voltage; MEMS; convective accelerometer; etching defects; fault modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Mixed-Signals, Sensors and Systems Test Workshop (IMS3TW), 2010 IEEE 16th International

Conference_Location

La Grande Motte

Print_ISBN

978-1-4244-7792-0

Electronic_ISBN

978-1-4244-7791-3

Type

conf

DOI

10.1109/IMS3TW.2010.5503011

Filename

5503011