• DocumentCode
    2917688
  • Title

    Fabrication and testing of a novel all-diamond neural probe for chemical detection and electrical sensing applications

  • Author

    Chan, H.Y. ; Aslam, D.M. ; Wang, S.H. ; Swain, G.M. ; Wise, K.D.

  • Author_Institution
    Michigan State Univ., East Lansing
  • fYear
    2008
  • fDate
    13-17 Jan. 2008
  • Firstpage
    244
  • Lastpage
    247
  • Abstract
    Fabrication and testing of all-diamond probes for neural applications is reported for the first time. Instead of commonly used silicon, undoped polycrystalline diamond (poly-C) with resistivity of ~105 Omegacm was chosen as the structural material of the probe. In addition, highly boron-doped (resistivity of ~10-3 Omegacm) poly-C film was used as the electrode material due to its excellent electrochemical properties and resistance to chemical attack. The diamond probe consists of 8 electrode sites with diameters ranging from 20 to 150 mum. The measured electrochemical potential window of the poly-C electrode was approximately -0.8 to 1.4 V in 1 M KCl. Initial measurements of electrochemical detection of a neurotransmitter called norepinephrine (NE) are very encouraging.
  • Keywords
    biochemistry; biosensors; boron; diamond; electrochemical electrodes; electrochemical sensors; microelectrodes; neurophysiology; all-diamond neural microprobe; boron-doped poly-C film; electrical sensing applications; electrochemical detection; electrochemical potential; electrochemical properties; neurotransmitter; norepinephrine; size 20 mum to 150 mum; undoped polycrystalline diamond; Chemicals; Conductivity; Electrical resistance measurement; Electrodes; Fabrication; Kirchhoff´s Law; Neurotransmitters; Probes; Silicon; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
  • Conference_Location
    Tucson, AZ
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-1792-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2008.4443638
  • Filename
    4443638