• DocumentCode
    2917718
  • Title

    Dual drug delivery device for chronic pain management using micromachined elastic metal structures and silicon microvalves

  • Author

    Evans, Allan T. ; Park, Jong M. ; Chiravuri, Srinivas ; Gianchandani, Yogesh B.

  • Author_Institution
    Univ. of Michigan, Ann Arbor
  • fYear
    2008
  • fDate
    13-17 Jan. 2008
  • Firstpage
    252
  • Lastpage
    255
  • Abstract
    This paper describes a dual-chamber drug delivery microsystem that provides regulated flow from two spring- pressurized balloon reservoirs using independent microvalves. A preliminary prototype has been constructed with the primary components. Micromachined bulk metal springs (Co-Ni-Cr alloy), with an in-plane spring constant exceeding 300 N/m, are used in conjunction with 18.8 mL reservoirs, and provide 15 kPA pressure when the balloons are fully inflated. A piezoresistive pressure sensor that is embedded in the microvalves monitors reservoir pressure with a sensitivity of 250 ppm/kPa, and is used to regulate bolus delivery. Two control plans for the valve and their respective limitations are presented. In a demonstration of regulated bolus delivery, 1.5 mL bolus doses are delivered at different rates.
  • Keywords
    bioMEMS; chromium alloys; cobalt alloys; dosimetry; drug delivery systems; elastic constants; intelligent sensors; micromachining; microvalves; nickel alloys; piezoresistive devices; pressure sensors; silicon; springs (mechanical); CoNiCr; Si; bolus doses; chronic pain management; dual drug delivery device; dual-chamber drug delivery microsystem; flow regulation; in-plane spring constant; metal springs; micromachined elastic metal structures; microvalves monitors; piezoresistive pressure sensor; pressure 15 kPa; regulated bolus delivery; silicon microvalves; spring- pressurized balloon reservoirs; Batteries; Costs; Drug delivery; Microvalves; Pain; Prototypes; Reservoirs; Silicon; Springs; Valves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
  • Conference_Location
    Tucson, AZ
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-1792-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2008.4443640
  • Filename
    4443640