Title :
PCB MEMS for environmental sensing systems
Author :
Fries, D. ; Broadbent, H. ; Steimle, George ; Ivanov, Sergiu ; Fu, Jianming ; Weller, Tom ; Natarajan, Sriraam ; Guerra, L.
Author_Institution :
Center for Ocean Technol., Univ. of South Florida, St. Petersburg, FL, USA
Abstract :
We are developing integrated microsystems and sensor networks for in-water measurements using PCB MEMS, also known as organic MEMS. The PCB MEMS laminates are based on liquid crystal polymers (LCP), polyimide (PI) and FR-4 materials with the various sensing elements made within or on top of the printed circuit substrates. Single layer, double layer, and laminate constructions have been achieved. The sensing systems that utilize this technology are directed toward chemical, biological and physical sensing devices. Recent progress in sensor development has yielded PCB MEMS sensors operating in the field. We have developed a multisensor system that measures conductivity, temperature and pressure, and a compact 3D system-in-package wireless module based on the 802.11b protocol. Combining the sensor and telemetry modules yields wireless sensor systems capable of being scaled into networks. The microsystems made in this economical PCB MEMS format can be utilized in the marine environment, especially in emerging adaptive sensor grids, but also be applied to terrestrial, atmospheric and industrial process control environments.
Keywords :
liquid crystal polymers; microsensors; printed circuits; sensor fusion; system-in-package; telemetry; wireless sensor networks; 802.11b protocol; FR-4 material; PCB MEMS; conductivity measurement; environmental sensing system; in-water measurement; industrial process control; integrated microsystems; liquid crystal polymers; multisensor system; organic MEMS; polyimide material; pressure measurement; printed circuit substrate; system-in-package wireless sensor networks; telemetry module; temperature measurement; Biosensors; Chemical and biological sensors; Chemical technology; Integrated circuit measurements; Laminates; Liquid crystal polymers; Micromechanical devices; Sensor systems; Temperature measurement; Wireless sensor networks;
Conference_Titel :
Industrial Electronics Society, 2005. IECON 2005. 31st Annual Conference of IEEE
Print_ISBN :
0-7803-9252-3
DOI :
10.1109/IECON.2005.1569271