Title :
Microfluidic systems in PCB technology
Author :
Pagel, Lienhard ; Gabmann, S.
Author_Institution :
Rostock Univ., Germany
Abstract :
In this paper a technology for the production of microfluidic systems is presented. In an overview the design and properties of produced fluidic elements are described. The basic element is a thermal driven micro pump using FR4 as basic material. A design of a pressure sensor in PCB using polyimide membranes demonstrates how to overcome problems with bad material properties like thermal expansion coefficient and the dependence of elastic constant on humidity of polyimide. The compensation of the pressure force with electrostatic force is one possibility for the elimination of material properties of membrane. The ability of the technology to integrate microfluidic elements, optical sensors and electronics in a monolithic PCB-stack is demonstrated by a development of a flow-injection-analysis (FIA). This analysis system contains two micro pumps, one fluid mixer, one optical detector, and one reservoir for the fluidic reagent and, of course, the electronics for the amplification of sensor-signals and the control unit for pumps. The correct functionality of the PCB-FIA is demonstrated by the detection of iron (III) ions using the reagent Thiocyanat.
Keywords :
compensation; iron; materials properties; microfluidics; micropumps; monolithic integrated circuits; optical deflectors; polymers; pressure sensors; printed circuits; FR4 material; PCB technology; Thiocyanat reagent; control unit; elastic constant; electrostatic force; flow-injection-analysis; fluid mixer; humidity; iron (III) ions; micro pump; microfluidic system; monolithic PCB-stack; optical detector; optical sensor; polyimide membrane; pressure force compensation; pressure sensor; reservoir; signal amplification; thermal expansion coefficient; Biomembranes; Force sensors; Humidity; Material properties; Microfluidics; Micropumps; Polyimides; Production systems; Thermal expansion; Thermal sensors;
Conference_Titel :
Industrial Electronics Society, 2005. IECON 2005. 31st Annual Conference of IEEE
Print_ISBN :
0-7803-9252-3
DOI :
10.1109/IECON.2005.1569274