DocumentCode :
2918522
Title :
Sealing method of PDMS as elastic material for MEMS
Author :
Sawano, Satoshi ; Naka, Keisuke ; Werber, Armin ; Zappe, Hans ; Konishi, Satoshi
Author_Institution :
Ritsumeikan Univ., Ritsumeikan
fYear :
2008
fDate :
13-17 Jan. 2008
Firstpage :
419
Lastpage :
422
Abstract :
This paper proposes an effective sealing method of PDMS (polydimethylsiloxane) without losing elasticity of the material. Parylene (poly-para-xylylene) CVD can caulk porous PDMS structure and provide low permeable characteristics. The longstanding drawback is that parylene deposition on PDMS spoils elastic features of PDMS. MEMS devices using deformation of PDMS such as micro pump and micro balloon actuator requires not only high sealing but also high elasticity of PDMS. Deposited parylene permeates PDMS and then forms a film on PDMS. Our key idea is to remove a surface parylene layer on PDMS with the aim of keeping elastic features of PDMS. O2 plasma etching is applied to remove unnecessary surface parylene. This paper evaluates sealing and elastic features of parylene-caulked PDMS. Componential analysis of provided material by FTIR spectrum (FT-720, HORIBA Inc) is also reported. Parylene-caulked PDMS is applied to pneumatic balloon actuator devices, PDMS membrane-based micro-mirror device, in order to demonstrate advantages of proposed method.
Keywords :
Fourier transform spectra; chemical vapour deposition; elasticity; infrared spectra; micromechanical devices; plasma materials processing; polymers; sealing materials; sputter etching; CVD; FTIR spectrum; MEMS; O2 plasma etching; PDMS membrane-based micro-mirror device; elastic material; parylene-caulked PDMS; pneumatic balloon actuator devices; polydimethylsiloxane; sealing method; Actuators; Elasticity; Etching; Microelectromechanical devices; Micromechanical devices; Micropumps; Plasma applications; Plasma devices; Plasma materials processing; Sealing materials;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
Conference_Location :
Tucson, AZ
ISSN :
1084-6999
Print_ISBN :
978-1-4244-1792-6
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2008.4443682
Filename :
4443682
Link To Document :
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