DocumentCode :
2918862
Title :
Performance characterization of miniaturized dielectric elastomer actuators fabricated using metal ion implantation
Author :
Rosset, S. ; Niklaus, M. ; Dubois, P. ; Shea, H.R.
Author_Institution :
Microsystems for Space Technol. Lab., Lausanne
fYear :
2008
fDate :
13-17 Jan. 2008
Firstpage :
503
Lastpage :
506
Abstract :
We report measurements of displacement and mechanical work for miniaturized dielectric elastomer actuators (DEAs) whose compliant electrodes were fabricated using metal ion implantation. 20 to 30 mum thick polydimethylsiloxane (PDMS) membranes were bonded to silicon chips with through holes of diameter 2 to 3 mm and were implanted on both sides with gold ions. Out-of-plane deflection recorded as a function of voltage and applied mechanical distributed load was in very good agreement with an analytical model. Unloaded vertical displacements up to 7% of the membrane´s diameter were recorded and mechanical work up to 0.3 muJ was obtained with an applied pressure of 1 kPa. This performance data and associated model allow such miniaturized polymer actuators to be efficiently dimensioned for different applications, for instance in micropumps and active optical devices.
Keywords :
bonding processes; dielectric materials; displacement measurement; electrodes; ion implantation; membranes; microactuators; polymers; active optical devices; displacement measurements; electrodes fabrication; mechanical distributed load; mechanical work measurements; metal ion implantation; micropumps; miniaturized dielectric elastomer actuators characterization; miniaturized polymer actuators model; out-of-plane deflection recording; polydimethylsiloxane membranes; pressure 1 kPa; silicon chip bonding; size 2 mm to 3 mm; size 20 mum to 30 mum; Actuators; Biomembranes; Bonding; Dielectric measurements; Displacement measurement; Electrodes; Ion implantation; Mechanical variables measurement; Semiconductor device measurement; Thickness measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
Conference_Location :
Tucson, AZ
ISSN :
1084-6999
Print_ISBN :
978-1-4244-1792-6
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2008.4443703
Filename :
4443703
Link To Document :
بازگشت