DocumentCode
2918934
Title
Multilayer techniques for MMICs
Author
Khalid, A.H. ; Gokdemir, T. ; Economides, S. ; Rezazadeh, A.A. ; Robertson, I.D.
Author_Institution
Dept. of Electron. & Electr. Eng., King´´s Coll., London, UK
fYear
1996
fDate
35384
Firstpage
42522
Lastpage
42526
Abstract
MMICs still use large numbers of passive components, both lumped elements (spiral inductors and overlay capacitors) and transmission lines and couplers. The area consumed by these can be drastically reduced by the use of multilayer techniques. However, producing MMICs with 3 or more metal layers requires research into the fabrication techniques as well as investigating the modelling and design problems. This paper describes these multilayer techniques which are expected to facilitate an increase in the packing density of commercially fabricated MMICs in the future
Keywords
MMIC; MMICs; couplers; design; fabrication; lumped elements; modelling; multilayer techniques; overlay capacitors; packing density; passive components; spiral inductors; transmission lines;
fLanguage
English
Publisher
iet
Conference_Titel
Advanced Developments in Microelectronic Engineering (Digest No: 1996/235), IEE Colloquium on
Conference_Location
London
Type
conf
DOI
10.1049/ic:19961245
Filename
640875
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