• DocumentCode
    2919075
  • Title

    Droplet and particle manipulation in emulsions and suspensions using 3D electro-osmotic micropumps

  • Author

    Hilber, W. ; Weiss, B. ; Mikolasek, M. ; Holly, R. ; Hingerl, K. ; Jakoby, B.

  • Author_Institution
    Johannes Kepler Univ., Linz
  • fYear
    2008
  • fDate
    13-17 Jan. 2008
  • Firstpage
    551
  • Lastpage
    554
  • Abstract
    This paper presents investigations on droplet and particle manipulation in microfiuidic channels realized in SU-8/glass technology, which is based on a competitive interplay of viscous drag, gravitational, buoyancy and dielectrophoretic forces. The latter are induced by alternating current (AC) driven three-dimensional (3D) stepped electrode arrays in the channel, enabling so called 3D AC electro-osmotic pumping, as it has been proposed recently. Due to size- and density-dependent differences in polarizability, targeted particles resp. droplets in the fluid stream can be slowed down or even pinned above the electrode structures by adjusting the operation parameters of the pump. Hence the presented device can be utilized for simultaneous pumping and manipulation of droplets and particles in emulsions and suspensions.
  • Keywords
    arrays; drag; drops; electrochemical electrodes; electrophoresis; emulsions; glass; microfluidics; micropumps; osmosis; slip flow; suspensions; 3D AC electro-osmotic micropumps; SU-8-glass technology; alternating current driven three-dimensional stepped electrode arrays; buoyancy forces; dielectrophoretic forces; droplet manipulation; emulsions; gravitational forces; microfiuidic channels; particle manipulation; suspensions; viscous drag; Electrodes; Etching; Glass; Microelectronics; Microfluidics; Micropumps; Pumps; Suspensions; Voltage; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
  • Conference_Location
    Tucson, AZ
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-1792-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2008.4443715
  • Filename
    4443715