DocumentCode
2919921
Title
Piezoresistive effect in top-down fabricated silicon nanowires
Author
Reck, K. ; Richter, J. ; Hansen, O. ; Thomsen, E.V.
Author_Institution
Tech. Univ. of Denmark, Lyngby
fYear
2008
fDate
13-17 Jan. 2008
Firstpage
717
Lastpage
720
Abstract
We have designed and fabricated silicon test chips to investigate the piezoresistive properties of both crystalline and polycrystalline nanowires using a top-down approach, in order to comply with conventional fabrication techniques. The test chip consists of 5 silicon nanowires and a reference resistor, each with integrated contacts for electrical 4-point measurements. We show an increase in the piezoresistive effect of 633% compared to bulk silicon. Preliminary temperature measurements indicate a larger temperature dependence of silicon nanowires, compared to bulk silicon. An increase of up to 34% compared to bulk polysilicon is observed in polysilicon nanowires with decreasing dimensions.
Keywords
electron beam lithography; nanolithography; nanowires; piezoresistance; silicon; EBL; bulk polysilicon; e-beam lithography; electrical four-point measurements; piezoresistive effect; silicon test chips; top-down fabricated silicon nanowires; Contacts; Crystallization; Electric variables measurement; Fabrication; Nanowires; Piezoresistance; Resistors; Semiconductor device measurement; Silicon; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
Conference_Location
Tucson, AZ
ISSN
1084-6999
Print_ISBN
978-1-4244-1792-6
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2008.4443757
Filename
4443757
Link To Document