DocumentCode
2920402
Title
Low-power hermetically sealed on-chip plasma light source micromachined in glass
Author
Carazzetti, P. ; Renaud, Ph ; Shea, H.
Author_Institution
Ecole Polytech. Fed. de Lausanne, Lausanne
fYear
2008
fDate
13-17 Jan. 2008
Firstpage
818
Lastpage
821
Abstract
We report on the fabrication and testing of a chip-scale plasma light source. The device consists of a stack of three anodically bonded Pyrex wafers, which hermetically enclose a gas-filled cavity in which electrodes are used to ignite a low power (<500 mW) RF plasma.
Keywords
glass; light sources; micromechanical devices; plasma materials processing; Pyrex wafers; RF plasma; gas-filled cavity; glass; micromachines; on-chip plasma light source; Electrodes; Fabrication; Glass; Hermetic seals; Light sources; Plasma devices; Plasma sources; Radio frequency; Testing; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
Conference_Location
Tucson, AZ
ISSN
1084-6999
Print_ISBN
978-1-4244-1792-6
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2008.4443782
Filename
4443782
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