• DocumentCode
    2920473
  • Title

    A multistage in-plane micro-thermoelectric cooler

  • Author

    Gross, Andrew ; Huang, Baoling ; Hwang, Gi-Suk ; Lawrence, Chris ; Ghafouri, Niloufar ; Lee, Sang Woo ; Kim, Hanseup ; Uher, Citrad ; Kaviany, Massoud ; Najafi, Khalil

  • Author_Institution
    Univ. of Michigan, Ann Arbor
  • fYear
    2008
  • fDate
    13-17 Jan. 2008
  • Firstpage
    840
  • Lastpage
    843
  • Abstract
    This paper presents a mutli-stage thermoelectric micro cooler designed for integration with a wide variety of MEMS devices, including MEMS resonators, which benefit from decreased phase noise at low temperatures. The cooler is fabricated using a multilayer process that allows the device to achieve thermal isolation greater than 10,000 K/W while still maintaining mechanical robustness for practical applications. Co-evaporated thin film bismuth telluride and antimony telluride are used as the thermoelectric materials. The cooler is 9 x 9 mm2 and a preliminary prototype has achieved cooling of 3.8 K, comparable to values predicted using a one-dimensional mathematical model.
  • Keywords
    antimony compounds; bismuth compounds; cooling; micromechanical devices; thermoelectric devices; Bi2Te3; MEMS device; antimony telluride; bismuth telluride; co-evaporated thin film; multilayer process; multistage inplane microthermoelectric cooler; temperature 3.8 K; thermal isolation; Bismuth; Microelectromechanical devices; Micromechanical devices; Noise robustness; Nonhomogeneous media; Phase noise; Temperature; Thermoelectric devices; Thermoelectricity; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
  • Conference_Location
    Tucson, AZ
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-1792-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2008.4443787
  • Filename
    4443787