DocumentCode :
2920473
Title :
A multistage in-plane micro-thermoelectric cooler
Author :
Gross, Andrew ; Huang, Baoling ; Hwang, Gi-Suk ; Lawrence, Chris ; Ghafouri, Niloufar ; Lee, Sang Woo ; Kim, Hanseup ; Uher, Citrad ; Kaviany, Massoud ; Najafi, Khalil
Author_Institution :
Univ. of Michigan, Ann Arbor
fYear :
2008
fDate :
13-17 Jan. 2008
Firstpage :
840
Lastpage :
843
Abstract :
This paper presents a mutli-stage thermoelectric micro cooler designed for integration with a wide variety of MEMS devices, including MEMS resonators, which benefit from decreased phase noise at low temperatures. The cooler is fabricated using a multilayer process that allows the device to achieve thermal isolation greater than 10,000 K/W while still maintaining mechanical robustness for practical applications. Co-evaporated thin film bismuth telluride and antimony telluride are used as the thermoelectric materials. The cooler is 9 x 9 mm2 and a preliminary prototype has achieved cooling of 3.8 K, comparable to values predicted using a one-dimensional mathematical model.
Keywords :
antimony compounds; bismuth compounds; cooling; micromechanical devices; thermoelectric devices; Bi2Te3; MEMS device; antimony telluride; bismuth telluride; co-evaporated thin film; multilayer process; multistage inplane microthermoelectric cooler; temperature 3.8 K; thermal isolation; Bismuth; Microelectromechanical devices; Micromechanical devices; Noise robustness; Nonhomogeneous media; Phase noise; Temperature; Thermoelectric devices; Thermoelectricity; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
Conference_Location :
Tucson, AZ
ISSN :
1084-6999
Print_ISBN :
978-1-4244-1792-6
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2008.4443787
Filename :
4443787
Link To Document :
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