Aeromems pressure sensor array featuring through-wafer vias for high-resolution wall pressure measurements

Design, fabrication, and characterization of novel MEMS (micro electromechanical system) pressure sensors featuring sealed through-wafer vias (TWV) and back side bond pads are presented. Thus the sensors can be flush mounted in a printed circuit board (PCB) and contacted on the back side. A linear sensor array consisting of 16 sensor chips has been realized employing a surface alignment and embedding technique. By avoiding flow disturbing bond wires and conducting paths on the front side of the PCB, the device is ideally suited for accurate and high-resolution wall pressure measurements in turbulent flows.