• DocumentCode
    2920839
  • Title

    Development of air-coupled ultrasound transducers for nondestructive evaluation

  • Author

    Xuefeng Wang ; Ying Fan ; Wei-Cheng Tian ; Hyon-Jin Kwon ; Kennedy, Sheldon ; Claydon, G. ; May, A.

  • Author_Institution
    GE Global Res. Center, Niskayuna
  • fYear
    2008
  • fDate
    13-17 Jan. 2008
  • Firstpage
    932
  • Lastpage
    935
  • Abstract
    We report the development of air-coupled ultrasound transducers for noncontact nondestructive evaluation applications. Air-coupled ultrasound is an attractive inspection technique for materials or structures that are not suitable for contact or immersion ultrasound inspections. However, due to large acoustic impedance mismatch between air and materials in the system, tremendous acoustic power losses exist. To overcome this problem, the efficiency of the ultrasound transducers needs to be improved. We have developed large-gap capacitive micromachined ultrasound transducers (CMUTs) that have high transduction efficiency in air. The CMUT has a patterned dielectric insulation layer that supports large acoustic output but eliminates dielectric breakdown or charging failures. Acoustic tests showed that the CMUTs had significantly higher transduction efficiency than the state-of-the-art commercial transducers. This indicates improvement of air-coupled CMUTs is achievable and may lead to wide use of CMUTs for air inspections.
  • Keywords
    ultrasonic materials testing; ultrasonic transducers; acoustic impedance mismatch; air-coupled ultrasound transducers; capacitive micromachined ultrasound transducers; dielectric breakdown; inspection technique; nondestructive evaluation; patterned dielectric insulation layer; Acoustic materials; Acoustic testing; Acoustic transducers; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Impedance; Inspection; Ultrasonic imaging; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
  • Conference_Location
    Wuhan
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-1792-6
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2008.4443810
  • Filename
    4443810