DocumentCode
2920839
Title
Development of air-coupled ultrasound transducers for nondestructive evaluation
Author
Xuefeng Wang ; Ying Fan ; Wei-Cheng Tian ; Hyon-Jin Kwon ; Kennedy, Sheldon ; Claydon, G. ; May, A.
Author_Institution
GE Global Res. Center, Niskayuna
fYear
2008
fDate
13-17 Jan. 2008
Firstpage
932
Lastpage
935
Abstract
We report the development of air-coupled ultrasound transducers for noncontact nondestructive evaluation applications. Air-coupled ultrasound is an attractive inspection technique for materials or structures that are not suitable for contact or immersion ultrasound inspections. However, due to large acoustic impedance mismatch between air and materials in the system, tremendous acoustic power losses exist. To overcome this problem, the efficiency of the ultrasound transducers needs to be improved. We have developed large-gap capacitive micromachined ultrasound transducers (CMUTs) that have high transduction efficiency in air. The CMUT has a patterned dielectric insulation layer that supports large acoustic output but eliminates dielectric breakdown or charging failures. Acoustic tests showed that the CMUTs had significantly higher transduction efficiency than the state-of-the-art commercial transducers. This indicates improvement of air-coupled CMUTs is achievable and may lead to wide use of CMUTs for air inspections.
Keywords
ultrasonic materials testing; ultrasonic transducers; acoustic impedance mismatch; air-coupled ultrasound transducers; capacitive micromachined ultrasound transducers; dielectric breakdown; inspection technique; nondestructive evaluation; patterned dielectric insulation layer; Acoustic materials; Acoustic testing; Acoustic transducers; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Impedance; Inspection; Ultrasonic imaging; Ultrasonic transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
Conference_Location
Wuhan
ISSN
1084-6999
Print_ISBN
978-1-4244-1792-6
Type
conf
DOI
10.1109/MEMSYS.2008.4443810
Filename
4443810
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