Vacuum-packaged micro fuel reformer for high thermal efficiency and low package temperature

Author

Kasuga, A. ; Tanaka, S. ; Esashi, M.

Author_Institution

Tohoku Univ., Sendai

fYear

2008

fDate

13-17 Jan. 2008

Firstpage

968

Lastpage

971

Abstract

A fully-microfabricated wafer-level vacuum package of a micro fuel reformer was designed, fabricated and tested. For thermal insulation, a high-temperature reactor is suspended by microfabricated tubes, in which fuel and reformed gas flow, and is vacuum-packaged by anodic bonding. Conductive heat loss through air in the package was investigated by making the packaging pressure as a parameter. The measured heat loss is 1.2 W at a reforming temperature of 240degC, showing a potential to realize a micro fuel reformer with a thermal efficiency of 75%. Also, the temperature of the package outside is as low as 60degC, which is enough to install the micro fuel reformer in portable electronics.

Keywords

bonding processes; reactors (electric); thermal insulation; thermal management (packaging); wafer level packaging; anodic bonding; high thermal efficiency; high-temperature reactor; low package temperature; microfuel reformer; portable electronics; reformed gas flow; temperature 240 C; thermal insulation; wafer-level vacuum package; Electron tubes; Electronic packaging thermal management; Fluid flow; Fuels; Gas insulation; Inductors; Temperature; Testing; Wafer bonding; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on

Conference_Location

Tucson, AZ

ISSN

1084-6999

Print_ISBN

978-1-4244-1792-6

Electronic_ISBN

1084-6999

Type

conf

DOI

10.1109/MEMSYS.2008.4443819

Filename

4443819