• DocumentCode
    2921024
  • Title

    Fabrication of a fully integrated electrospray array with applications to space propulsion

  • Author

    Gassend, B. ; Velásquez-García, L.F. ; Akinwande, A.I. ; Martínez-Sánchez, M.

  • Author_Institution
    Massachusetts Inst. of Technol., Cambridge
  • fYear
    2008
  • fDate
    13-17 Jan. 2008
  • Firstpage
    976
  • Lastpage
    979
  • Abstract
    A fully integrated MEMS planar electrospray array intended for space propulsion applications is reported. An extractor electrode, electrical insulation, liquid barriers and assembly clips are integrated into a single silicon and Pyrex component, fabricated with deep reactive ion etching (DRIE), laser micromachining and wafer bonding technology. An electrospray emitter head assembles by hand to the clips using a reversible high-precision hand-assembly method, allowing many emitters types to be tested with minimal fabrication effort. Externally-wetted emitters were formed using an alternation of DRIE and isotropic SF6 plasma etching. A simple model is reported allowing the prediction of emitter geometry from mask geometry and etching steps. The fabricated thruster weighing 5 g was successfully fired with a 502 emitters array, and was shown to operate in the pure ion emission regime using the ionic liquid EMI-BF4. Starting voltages as low as 500 V were observed, though the device was tested up to 5 kV without damage.
  • Keywords
    aerospace propulsion; ion engines; micromachining; micromechanical devices; sprays; sputter etching; wafer bonding; DRIE; MEMS planar electrospray array; Pyrex component; assembly clips; deep reactive ion etching; electrical insulation; electrospray emitter; extractor electrode; fully integrated electrospray array; high-precision hand-assembly method; ion emission; isotropic SF6 plasma etching; laser micromachining; liquid barriers; mask geometry; mass 5 g; space propulsion; wafer bonding technology; Assembly; Dielectrics and electrical insulation; Electrodes; Etching; Fabrication; Geometry; Micromechanical devices; Propulsion; Space technology; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
  • Conference_Location
    Tucson, AZ
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-1792-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2008.4443821
  • Filename
    4443821