DocumentCode :
2921107
Title :
Solenoidal micro coils manufactured with a wire bonder
Author :
Kratt, Kai ; Seidel, Marit ; Emmenegger, Markus ; Wallrabe, Ulrike ; Korvink, Jan G.
Author_Institution :
Univ. of Freiburg - IMTEK, Freiburg
fYear :
2008
fDate :
13-17 Jan. 2008
Firstpage :
996
Lastpage :
999
Abstract :
We present for the first time the development of 3-D solenoidal micro coils using an automatic wire bonder. By developing a stable and repeatable bond process with insulated wire, micro coils with sub-millimeter diameter have been manufactured. The winding process for a single coil takes about 200 ms, whereas the manufacture of a 100-coil-array takes less than a minute. Micro coils with 4 windings and a diameter of 690 mum exhibit an inductance of 12.7 nH and a resistance of 580 muOmega at 300 MHz. These values correspond to a quality factor of 41 and compare favorably lo state-of-the-art micro coil manufacturing technologies.
Keywords :
solenoids; winding (process); automatic wire bonder; solenoidal micro coils; winding process; Bonding; Coils; Conductors; Electric resistance; Inductance; Inductors; Manufacturing processes; Proximity effect; Solenoids; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
Conference_Location :
Tucson, AZ
ISSN :
1084-6999
Print_ISBN :
978-1-4244-1792-6
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2008.4443826
Filename :
4443826
Link To Document :
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