Title :
Miniaturized SAW filters using a flip-chip technique
Author :
Yatsuda, H. ; Horishima, T. ; Eimura, T. ; Ooiwa, T.
fDate :
Oct. 31 1994-Nov. 3 1994
Abstract :
This paper describes a miniature SAW filter, 3.2×2.5×0.9 mm3, which is applicable for RF-stage filters in mobile phones. The SAW filter is reduced in size by using a flip-chip assembly technique. The technique uses gold bumps on the SAW chip and gold-gold thermosonic face-down bonding. This bonding provides that a SAW chip is fixed mechanically and connected electrically with a package. A frequency response of a 950 MHz flip-chip SAW filter and results of reliability tests are shown
Keywords :
UHF filters; cordless telephone systems; flip-chip devices; frequency response; microassembling; mobile radio; reliability; surface acoustic wave filters; surface mount technology; 950 MHz; Au; Au bumps; Au-Au thermosonic face-down bonding; RF-stage filters; assembly technique; flip-chip technique; frequency response; miniaturized SAW filters; mobile phones; package; reliability tests; Assembly systems; Bonding; Portable radio communication; Reliability testing; Surface acoustic wave filters; Surface mounting; UHF filters;
Conference_Titel :
Ultrasonics Symposium, 1994. Proceedings., 1994 IEEE
Conference_Location :
Cannes, France
Print_ISBN :
0-7803-2012-3
DOI :
10.1109/ULTSYM.1994.401572
