DocumentCode
2921406
Title
DNA mediated sequential self-assembly of nano/micro components
Author
Kusakabe, T. ; Tanemura, T. ; Higuchi, Y. ; Sugano, K. ; Tsuchiya, T. ; Tabata, O.
Author_Institution
Kyoto Univ., Kyoto
fYear
2008
fDate
13-17 Jan. 2008
Firstpage
1052
Lastpage
1055
Abstract
A novel sequential self-assembly process of nano/micro components applying deoxyribonucleic acid (DNA) hybridization was proposed for the first time and its validity was experimentally verified. In the proposed process, characteristics of DNA, such as hybridization specificity of complementary pairs of single-stranded DNA (ssDNA) into a double-stranded DNA (dsDNA), and the dependence of hybridization on ambient temperature (melting temperature Tm) plays a key role. These characteristics of DNA can be designed and synthesized by base-pair sequence of DNA. Three types of self-assembly experiments using two types of ssDNA with different Tm (65degC and 50degC) were carried out; 1.) between Au nanoparticles, 2.) between Au nanoparticle and Au coated substrate, and 3.) between silicon micro components (5times5times3 mum3) and Au coated substrate. Through these experiments, it was successfully verified that the sequence of the self-assembly can be controlled by controlling the ambient temperature. The reversibility of this process was also confirmed. However, the silicon micro components assembly on Au coated substrate was not confirmed.
Keywords
DNA; gold; micromechanical devices; nanoparticles; self-assembly; silicon; DNA hybridization; base-pair sequence; deoxyribonucleic acid hybridization; double-stranded DNA; microcomponents; nanocomponents; nanoparticle; sequential self-assembly; single-stranded DNA; Assembly; Bonding; DNA; Gold; Hydrogen; Micromechanical devices; Self-assembly; Sequences; Silicon; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
Conference_Location
Tucson, AZ
ISSN
1084-6999
Print_ISBN
978-1-4244-1792-6
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2008.4443840
Filename
4443840
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