• DocumentCode
    2921406
  • Title

    DNA mediated sequential self-assembly of nano/micro components

  • Author

    Kusakabe, T. ; Tanemura, T. ; Higuchi, Y. ; Sugano, K. ; Tsuchiya, T. ; Tabata, O.

  • Author_Institution
    Kyoto Univ., Kyoto
  • fYear
    2008
  • fDate
    13-17 Jan. 2008
  • Firstpage
    1052
  • Lastpage
    1055
  • Abstract
    A novel sequential self-assembly process of nano/micro components applying deoxyribonucleic acid (DNA) hybridization was proposed for the first time and its validity was experimentally verified. In the proposed process, characteristics of DNA, such as hybridization specificity of complementary pairs of single-stranded DNA (ssDNA) into a double-stranded DNA (dsDNA), and the dependence of hybridization on ambient temperature (melting temperature Tm) plays a key role. These characteristics of DNA can be designed and synthesized by base-pair sequence of DNA. Three types of self-assembly experiments using two types of ssDNA with different Tm (65degC and 50degC) were carried out; 1.) between Au nanoparticles, 2.) between Au nanoparticle and Au coated substrate, and 3.) between silicon micro components (5times5times3 mum3) and Au coated substrate. Through these experiments, it was successfully verified that the sequence of the self-assembly can be controlled by controlling the ambient temperature. The reversibility of this process was also confirmed. However, the silicon micro components assembly on Au coated substrate was not confirmed.
  • Keywords
    DNA; gold; micromechanical devices; nanoparticles; self-assembly; silicon; DNA hybridization; base-pair sequence; deoxyribonucleic acid hybridization; double-stranded DNA; microcomponents; nanocomponents; nanoparticle; sequential self-assembly; single-stranded DNA; Assembly; Bonding; DNA; Gold; Hydrogen; Micromechanical devices; Self-assembly; Sequences; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
  • Conference_Location
    Tucson, AZ
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-1792-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2008.4443840
  • Filename
    4443840