DocumentCode :
2921406
Title :
DNA mediated sequential self-assembly of nano/micro components
Author :
Kusakabe, T. ; Tanemura, T. ; Higuchi, Y. ; Sugano, K. ; Tsuchiya, T. ; Tabata, O.
Author_Institution :
Kyoto Univ., Kyoto
fYear :
2008
fDate :
13-17 Jan. 2008
Firstpage :
1052
Lastpage :
1055
Abstract :
A novel sequential self-assembly process of nano/micro components applying deoxyribonucleic acid (DNA) hybridization was proposed for the first time and its validity was experimentally verified. In the proposed process, characteristics of DNA, such as hybridization specificity of complementary pairs of single-stranded DNA (ssDNA) into a double-stranded DNA (dsDNA), and the dependence of hybridization on ambient temperature (melting temperature Tm) plays a key role. These characteristics of DNA can be designed and synthesized by base-pair sequence of DNA. Three types of self-assembly experiments using two types of ssDNA with different Tm (65degC and 50degC) were carried out; 1.) between Au nanoparticles, 2.) between Au nanoparticle and Au coated substrate, and 3.) between silicon micro components (5times5times3 mum3) and Au coated substrate. Through these experiments, it was successfully verified that the sequence of the self-assembly can be controlled by controlling the ambient temperature. The reversibility of this process was also confirmed. However, the silicon micro components assembly on Au coated substrate was not confirmed.
Keywords :
DNA; gold; micromechanical devices; nanoparticles; self-assembly; silicon; DNA hybridization; base-pair sequence; deoxyribonucleic acid hybridization; double-stranded DNA; microcomponents; nanocomponents; nanoparticle; sequential self-assembly; single-stranded DNA; Assembly; Bonding; DNA; Gold; Hydrogen; Micromechanical devices; Self-assembly; Sequences; Silicon; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
Conference_Location :
Tucson, AZ
ISSN :
1084-6999
Print_ISBN :
978-1-4244-1792-6
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2008.4443840
Filename :
4443840
Link To Document :
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