Part tilting in capillary-based self-assembly: Modeling and correction methods

Author

Abbasi, Shaghayegh ; Zhou, Andrew X. ; Baskaran, Rajashree ; Böhringer, Karl F.

Author_Institution

Univ. of Washington, Seattle

fYear

2008

fDate

13-17 Jan. 2008

Firstpage

1060

Lastpage

1063

Abstract

We present a model and experimental results on tilt angle of microparts in capillary-driven self-assembly. The assembly is carried out in an aqueous environment, using a heat curable adhesive for part-substrate lubrication and mechanical bonding. Silicon parts and substrate have matching hydrophobic binding sites, which drive the assembly by surface energy minimization. Force balance analysis of an assembled part leads to a model describing the dependence of tilt angle on assembly parameters such as adhesive volume and water-adhesive interfacial tension. The effect of adhesive volume on tilt angle is investigated experimentally. Tilt correction of the assembled parts is achieved by providing external energy to the system via vertical vibration.

Keywords

adhesives; capillarity; elemental semiconductors; integrated circuit bonding; integrated circuit modelling; lubrication; microassembling; self-assembly; silicon; surface energy; surface tension; vibrations; wafer level packaging; adhesive volume parameters; aqueous environment; capillary-based self-assembly; force balance analysis; heat curable adhesive; hydrophobic binding sites; mechanical bonding; microparts tilt angle; part-substrate lubrication; silicon parts; surface energy minimization; tilt correction methods; vertical vibration; water-adhesive interfacial tension; Assembly systems; Fabrication; Gold; Integrated circuit interconnections; Microelectronics; Minimization; Robotic assembly; Self-assembly; Semiconductor device modeling; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on

Conference_Location

Tucson, AZ

ISSN

1084-6999

Print_ISBN

978-1-4244-1792-6

Electronic_ISBN

1084-6999

Type

conf

DOI

10.1109/MEMSYS.2008.4443842

Filename

4443842