• DocumentCode
    292145
  • Title

    Improved laser processing of lithium niobate

  • Author

    Christensen, F.K. ; Müllenborn, M.

  • Volume
    1
  • fYear
    1994
  • fDate
    Oct. 31 1994-Nov. 3 1994
  • Firstpage
    391
  • Abstract
    Successful laser processing of lithium niobate has so far only been done with lasers using photon energies well above the band gap energy (3.75 eV=330 nm). We report a highly improved method which enables us to do laser processing using a continuous wave (cw) laser operating at low power densities below the band gap energy of lithium niobate, giving us significantly higher removal rates than previously reported in the literature. Using 351 nm cw laser light (Ar+), high scan speed (100 mm/s), a spot size of 8 μm and 300 mW of laser power results in removal rates in excess of 106 μm3/s. Combined with the possibility of precise focusing (1 μm) and high positioning accuracy (100 nm) of the laser beam, this opens up several new possibilities: micromachining of small piezoelectric structures, simple etching of grooves for a controlled positioning of optical fibers, or etching of grooves in SAW-devices
  • Keywords
    acoustic materials; etching; laser beam etching; laser materials processing; lithium compounds; piezoelectric materials; 300 mW; 351 nm; Ar+ laser; LiNbO3; SAW-devices; continuous wave laser; etching; focusing; grooves; laser processing; lithium niobate; micromachining; optical fibers; piezoelectric structures; positioning; removal rates; subband gap energies; Etching; Laser materials-processing applications; Lithium materials/devices; Piezoelectric materials/devices; Surface acoustic wave materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1994. Proceedings., 1994 IEEE
  • Conference_Location
    Cannes, France
  • Print_ISBN
    0-7803-2012-3
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1994.401616
  • Filename
    401616