DocumentCode
292145
Title
Improved laser processing of lithium niobate
Author
Christensen, F.K. ; Müllenborn, M.
Volume
1
fYear
1994
fDate
Oct. 31 1994-Nov. 3 1994
Firstpage
391
Abstract
Successful laser processing of lithium niobate has so far only been done with lasers using photon energies well above the band gap energy (3.75 eV=330 nm). We report a highly improved method which enables us to do laser processing using a continuous wave (cw) laser operating at low power densities below the band gap energy of lithium niobate, giving us significantly higher removal rates than previously reported in the literature. Using 351 nm cw laser light (Ar+), high scan speed (100 mm/s), a spot size of 8 μm and 300 mW of laser power results in removal rates in excess of 106 μm3/s. Combined with the possibility of precise focusing (1 μm) and high positioning accuracy (100 nm) of the laser beam, this opens up several new possibilities: micromachining of small piezoelectric structures, simple etching of grooves for a controlled positioning of optical fibers, or etching of grooves in SAW-devices
Keywords
acoustic materials; etching; laser beam etching; laser materials processing; lithium compounds; piezoelectric materials; 300 mW; 351 nm; Ar+ laser; LiNbO3; SAW-devices; continuous wave laser; etching; focusing; grooves; laser processing; lithium niobate; micromachining; optical fibers; piezoelectric structures; positioning; removal rates; subband gap energies; Etching; Laser materials-processing applications; Lithium materials/devices; Piezoelectric materials/devices; Surface acoustic wave materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 1994. Proceedings., 1994 IEEE
Conference_Location
Cannes, France
Print_ISBN
0-7803-2012-3
Type
conf
DOI
10.1109/ULTSYM.1994.401616
Filename
401616
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