Test circuits for deep sub-micron surface acoustic wave devices

Author

Hohkawa, Kohji ; Noge, Satoru ; Huang, Qixin

Volume

1

fYear

1994

fDate

Oct. 31 1994-Nov. 3 1994

Firstpage

429

Abstract

High frequency SAW devices operating at multi-GHz will be vital for future systems, such as communication systems, consumer electronics and measurement equipment. Major problems to be solved are forming low resistance thin metal films and patterning sub-micron electrodes. We have studied process conditions for high quality thin-metal-film deposition using a simple sputtering and EB deposition system, and for patterning fine electrode patterns using simple 2-layer-resist electron beam lithography. Test circuits with fine electrodes and reflective grating patterns with sizes from 0.1 um to 0.5 um are fabricated successfully

Keywords

acoustic microwave devices; electron beam deposition; electron beam lithography; interdigital transducers; metallisation; sputter deposition; surface acoustic wave devices; surface acoustic wave filters; test equipment; 0.1 to 0.5 mum; EB deposition system; IDT; SAW filter; deep sub-micron surface acoustic wave devices; electron beam lithography; fine electrodes; high frequency SAW devices; low resistance thin metal films; multi-GHz region; patterning sub-micron electrodes; reflective grating patterns; sputtering; test circuits; Acoustic testing; Electron beam lithography; Interdigital transducers; Metallization; Sputtering; Surface acoustic wave device fabrication; Surface acoustic wave filters; Vapor deposition;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 1994. Proceedings., 1994 IEEE

Conference_Location

Cannes, France

Print_ISBN

0-7803-2012-3

Type

conf

DOI

10.1109/ULTSYM.1994.401623

Filename

401623