DocumentCode
2921988
Title
Foreword
fYear
2008
fDate
12-16 Oct. 2008
Abstract
Presents the introductory welcome message from the conference proceedings.
Keywords
Atmosphere; Circuits; High K dielectric materials; Maintenance; Meetings; Niobium compounds; Quality assurance; Robustness; Semiconductor device reliability; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2008. IRW 2008. IEEE International
Conference_Location
S. Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4244-2194-7
Type
conf
DOI
10.1109/IRWS.2008.4796070
Filename
4796070
Link To Document