• DocumentCode
    2922070
  • Title

    Total Recovery of Defects Generated by Negative Bias Temperature Instability (NBTI)

  • Author

    Benar, Christelle ; Ogier, Jean-Luc ; Goguenheim, Didier

  • Author_Institution
    ST Microelectron., Zone Ind. Rousset, Rousset
  • fYear
    2008
  • fDate
    12-16 Oct. 2008
  • Firstpage
    7
  • Lastpage
    11
  • Abstract
    NBTI degradation is known to generate defects which can partially recover during a fast interruption. This paper investigates the hole de-trapping effect but also re-trapping kinetics and re-passivation of interface states. The comparison of relaxation at low and high temperatures allows us to conclude that the annealing at 300degC is a real recovery and healing of oxide defects. Indeed, interface states are totally re-passivated and hole traps are de-trapped but have also totally recovered. Furthermore, we show that the retrapping time of oxide traps is three times longer than their generation whatever the stress conditions and relaxation times.
  • Keywords
    annealing; hole traps; interface states; passivation; semiconductor device reliability; annealing; hole detrapping effect; interface states; negative bias temperature instability; oxide defect recovery; relaxation time; stress conditions; temperature 300 degC; Degradation; Hydrogen; Interface states; Low voltage; MOSFET circuits; Microelectronics; Negative bias temperature instability; Niobium compounds; Stress; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2008. IRW 2008. IEEE International
  • Conference_Location
    S. Lake Tahoe, CA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4244-2194-7
  • Electronic_ISBN
    1930-8841
  • Type

    conf

  • DOI
    10.1109/IRWS.2008.4796075
  • Filename
    4796075