DocumentCode :
2922350
Title :
Effective Process Equipment Defect Control Methodology
Author :
Bousetta, Ali ; Cross, Andrew J.
Author_Institution :
KLA-Tencor Corp., Milpitas
fYear :
2007
fDate :
11-12 June 2007
Firstpage :
43
Lastpage :
47
Abstract :
The aggressive shrinking of design rules with the increasing requirement to reduce costs of running a 300 mm Fab are pushing equipment particle performance to lower defectivity counts and tighter control. The rapid qualification of process equipment and the identification of excursions on monitor wafers before the product is committed is an important metric of a Fab strategy to minimize the product at risk and control cost (faster time to detect/fix excursion). This paper will focus on examining different techniques used to cope with excursion data and help maintain an optimum balance between alpha and beta risks by applying them to real data from a production line. These techniques will be compared using metrics such practicality, effectiveness and robustness.
Keywords :
production equipment; semiconductor device manufacture; statistical process control; defect monitoring; design rules; excursion control; excursion identification; process equipment defect control methodology; statistical process control methods; Costs; Data engineering; Histograms; Maintenance engineering; Monitoring; Performance analysis; Process control; Production; Qualifications; Robustness; Excursion control; defect monitoring; process control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2007. ASMC 2007. IEEE/SEMI
Conference_Location :
Stresa
Print_ISBN :
1-4244-0652-8
Electronic_ISBN :
1-4244-0653-6
Type :
conf
DOI :
10.1109/ASMC.2007.375078
Filename :
4259244
Link To Document :
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