DocumentCode
2922350
Title
Effective Process Equipment Defect Control Methodology
Author
Bousetta, Ali ; Cross, Andrew J.
Author_Institution
KLA-Tencor Corp., Milpitas
fYear
2007
fDate
11-12 June 2007
Firstpage
43
Lastpage
47
Abstract
The aggressive shrinking of design rules with the increasing requirement to reduce costs of running a 300 mm Fab are pushing equipment particle performance to lower defectivity counts and tighter control. The rapid qualification of process equipment and the identification of excursions on monitor wafers before the product is committed is an important metric of a Fab strategy to minimize the product at risk and control cost (faster time to detect/fix excursion). This paper will focus on examining different techniques used to cope with excursion data and help maintain an optimum balance between alpha and beta risks by applying them to real data from a production line. These techniques will be compared using metrics such practicality, effectiveness and robustness.
Keywords
production equipment; semiconductor device manufacture; statistical process control; defect monitoring; design rules; excursion control; excursion identification; process equipment defect control methodology; statistical process control methods; Costs; Data engineering; Histograms; Maintenance engineering; Monitoring; Performance analysis; Process control; Production; Qualifications; Robustness; Excursion control; defect monitoring; process control;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2007. ASMC 2007. IEEE/SEMI
Conference_Location
Stresa
Print_ISBN
1-4244-0652-8
Electronic_ISBN
1-4244-0653-6
Type
conf
DOI
10.1109/ASMC.2007.375078
Filename
4259244
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