Using FEA to develop a MIL-HDBK-2 17 SMT model

Author

Bivens, Gretchen A. ; Pello, Edward F.

Author_Institution

Rome Lab., Griffiss AFB, NY, USA

fYear

1992

fDate

March 31 1992-April 2 1992

Firstpage

151

Lastpage

156

Abstract

A MIL-HDBK-217, Military Handbook for Reliability Prediction of Electronic Equipment, reliability prediction model was developed for surface mount technology (SMT) using thermal finite element analysis (FEA) simulations and environmental test data. FEAs for a number of conditions and packages were performed, the resulting strain values were translated to number of cycles to failure, and data regression distribution techniques were used to generate a failure rate model. This methodology, which is based on established analytical techniques and procedures, provides an alternative procedure for developing failure rate models when traditional approaches are not applicable.<>

Keywords

finite element analysis; military equipment; packaging; printed circuits; reliability; surface mount technology; MIL-HDBK-217; Military Handbook; SMT model; data regression distribution techniques; environmental test data; established analytical techniques; failure rate model; military equipment; number of cycles to failure; procedure for developing failure rate models; reliability prediction model; strain values; surface mount technology; thermal finite element analysis; Analytical models; Capacitive sensors; Electronic equipment; Electronic equipment testing; Electronic packaging thermal management; Finite element methods; Military equipment; Packaging machines; Predictive models; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium 1992. 30th Annual Proceedings., International

Conference_Location

San Diego, CA, USA

Print_ISBN

0-7803-0473-X

Type

conf

DOI

10.1109/RELPHY.1992.187640

Filename

187640