DocumentCode
2922540
Title
Managing Sunset & Closure of a Semiconductor Technology parallel to aggressive new process Ramp
Author
Bouhnik, Sylvain
Author_Institution
Intel Electron. Ltd., Kiryat Gat
fYear
2007
fDate
11-12 June 2007
Firstpage
184
Lastpage
187
Abstract
In the current dynamic and volatile environment of semiconductor manufacturing, factories are attempting to retool and aggressively ramp-up new technologies while ramping down existing processes. An Intel factory recently transitioned from producing 180 nm logic devices to producing 90 nm flash products. During this transition period the factory gradually discontinued its logic volume while ramping-up flash. In this paper, we will review the overall set of assumptions that were made towards the logic process ramp down and recommendations for future sunset procedures. Since some of the assumptions were materialized and some assumptions did not match reality, an extensive lessons-learned process was conducted for future technology changes.
Keywords
organisational aspects; semiconductor device manufacture; flash products; logic devices; process ramp; semiconductor manufacturing; sunset procedures; Bills of materials; Capacity planning; Environmental management; Inventory management; Logic devices; Manufacturing processes; Optimized production technology; Production facilities; Semiconductor device manufacture; Technology management; Capacity planning; Process Deramp; Process ramp; Technology sunset; WIP management;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2007. ASMC 2007. IEEE/SEMI
Conference_Location
Stresa
Print_ISBN
1-4244-0652-8
Electronic_ISBN
1-4244-0653-6
Type
conf
DOI
10.1109/ASMC.2007.375088
Filename
4259254
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