The impact of delamination on stress-induced and contamination-related failure in surface mount ICs

Author

Moore, T.M. ; Kelsall, S.J.

Author_Institution

Texas Instruments- Inc., Dallas, TX, USA

fYear

1992

fDate

March 31 1992-April 2 1992

Firstpage

169

Lastpage

176

Abstract

A temperature-cycle evaluation is reported of a large-die 132-pin plastic quad flat pack process which includes a comparison of the performances of three mold compounds, two lead frame finishes, and two die surface conditions with and without a polyimide die overcoat. The effect of contamination and moisture exposure on bond pad integrity in 68-pin leaded chip carriers damaged during solder reflow was also examined.<>

Keywords

VLSI; failure analysis; packaging; reliability; soldering; surface mount technology; 132-pin; 68-pin; PQFP; bond pad integrity; contamination; contamination-related failure; delamination; die surface conditions; large-die; lead frame finishes; leaded chip carriers; moisture exposure; mold compounds; plastic quad flat pack process; polyimide die overcoat; solder reflow; stress induced failure; surface mount ICs; temperature-cycle evaluation; Bonding; Delamination; Electronics packaging; Lead compounds; Moisture; Performance evaluation; Plastics; Polyimides; Surface contamination; Surface finishing;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium 1992. 30th Annual Proceedings., International

Conference_Location

San Diego, CA, USA

Print_ISBN

0-7803-0473-X

Type

conf

DOI

10.1109/RELPHY.1992.187642

Filename

187642