Title :
Fully Automatical Test and Qualification System for a High Endurance Embedded EEPROM Module
Author :
Fellner, Johannes ; Schatzberger, Gregor ; Wiesner, Andreas
Author_Institution :
Austriamicrosystems AG, Unterpremstaetten
Abstract :
Qualifying a high temperature, high endurance and high reliability integrated EEPROM process module according the JEDEC and AEC standard needs a large number of tested devices. Correlations of various analog and digital measurements must be done at different supply voltages, temperature conditions and with process variations to ensure a stable high yielding process module. Long program and erase times (milliseconds) for an EEPROM process option result in time consuming measurements. The costs of such a qualification will be comparatively high if all tests are done with production test equipment. Therefore, a test chip concept allowing a wide range of memory sizes was defined for use with a standard PLCC68 package. This package is able to withstand temperatures up to 180degC. Based on the test chip, a parallel, low cost test system was developed enabling the measurement of 96 devices in parallel and hence significantly reducing the test and qualification time and costs.
Keywords :
EPROM; automatic test equipment; integrated circuit reliability; integrated circuit testing; integrated memory circuits; AEC standard; JEDEC standard; automatic test and qualification system; high endurance embedded EEPROM module; integrated EEPROM process module; production test equipment; standard PLCC68 package; test chip concept; Automatic testing; Costs; EPROM; Packaging machines; Qualifications; Semiconductor device measurement; System testing; Temperature; Time measurement; Voltage;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2008. IRW 2008. IEEE International
Conference_Location :
S. Lake Tahoe, CA
Print_ISBN :
978-1-4244-2194-7
Electronic_ISBN :
1930-8841
DOI :
10.1109/IRWS.2008.4796100