• DocumentCode
    2922607
  • Title

    Parallel Manufacturing Ramp of an SOI-based Microprocessor Chip

  • Author

    Liehr, Michael ; Uram, Kevin J. ; Leong, C.K.

  • Author_Institution
    IBM Syst. & Technol. Group, Hopewell Junction
  • fYear
    2007
  • fDate
    11-12 June 2007
  • Firstpage
    201
  • Lastpage
    205
  • Abstract
    The challenges of and approaches to a technology transfer of a 90 nm silicon-on-insulator technology in support of a parallel high volume manufacturing ramp are described.
  • Keywords
    integrated circuit manufacture; microprocessor chips; silicon-on-insulator; technology transfer; SOI-based microprocessor chip; parallel manufacturing ramp; silicon-on-insulator; size 90 nm; technology transfer; Furnaces; Hardware; Inspection; Manufacturing industries; Microprocessor chips; Pulp manufacturing; Semiconductor device manufacture; Silicon on insulator technology; Technology transfer; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference, 2007. ASMC 2007. IEEE/SEMI
  • Conference_Location
    Stresa
  • Print_ISBN
    1-4244-0652-8
  • Electronic_ISBN
    1-4244-0653-6
  • Type

    conf

  • DOI
    10.1109/ASMC.2007.375092
  • Filename
    4259258
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2922607