Title :
Finite element analysis of a SWEAT structure with a 3-D, nonlinear, coupled thermal-electric model
Author :
Dion, Michael J.
Author_Institution :
SEMATECH, Austin, TX, USA
fDate :
March 31 1992-April 2 1992
Abstract :
The complexities of determining thermal characteristics within the standard wafer electromigration accelerated test (SWEAT) structure during accelerated metal integrity or electromigration tests are discussed. A 3-D, nonlinear, coupled thermal-electric finite element model is developed and was solved with the ANSYS program to investigate heat flow in several regions of the structure. The finite element model is presented. Correlation with nonlinear thermal material parameters is demonstrated, and the importance of modeling lateral heat flow in underlying oxides is shown. Extraction of thermal parameters for use in the EXTRA thermal model is discussed.<>
Keywords :
electromigration; electronic engineering computing; finite element analysis; heat conduction; life testing; metallisation; ANSYS program; EXTRA thermal model; SWEAT structure; accelerated testing; coupled thermal-electric model; electromigration tests; finite element model; heat flow; metal integrity testing; modeling lateral heat flow; nonlinear thermal material parameters; standard wafer electromigration accelerated test; thermal parameters extraction; underlying oxides; Coupled mode analysis; Couplings; Electromigration; Equations; Finite element methods; Heating; Life estimation; Solid modeling; Temperature; Testing;
Conference_Titel :
Reliability Physics Symposium 1992. 30th Annual Proceedings., International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-0473-X
DOI :
10.1109/RELPHY.1992.187651
