DocumentCode :
2922732
Title :
Corrosion susceptibility of thin-film metallizations
Author :
Griffin, A.J., Jr. ; Brotzen, F.R. ; McPherson, J.W. ; Dunn, C.F.
Author_Institution :
Dept. of Mater. Sci., Rice Univ., Houston, TX, USA
fYear :
1992
fDate :
March 31 1992-April 2 1992
Firstpage :
239
Lastpage :
246
Abstract :
Anodic DC polarization and AC electrochemical impedance-spectroscopy techniques were applied to obtain a better understanding of the corrosion process in Al and Al-Cu thin-film metallizations. The oxide-layer resistance, oxide-layer/double-layer capacitance, and anodic-polarization scans of Al and Al-Co thin-film metallizations which have been sputtered onto partially oxidized silicon substrates are correlated to oxide-layer thickness, Cu distribution, and oxide-layer integrity. Auger electron spectroscopy was employed to quantify oxide-layer thickness and its apparent influence on impedance-spectroscopy response, while scanning electron microscopy was used to observe the type of corrosion attack. The results discussed are compared with results previously obtained on bulk Al-Co alloys.<>
Keywords :
aluminium; aluminium alloys; copper alloys; corrosion testing; metallic thin films; metallisation; sputtered coatings; AC electrochemical impedance-spectroscopy; Al metallisation; Al-Co alloys; Al-Cu metallisation; Cu distribution; SiO/sub 2/ substrates; anodic DC polarisation; anodic-polarization scans; corrosion process; corrosion susceptibility; oxide layer capacitance; oxide-layer resistance; oxide-layer thickness; scanning electron microscopy; thin-film metallizations; Capacitance; Corrosion; Electrons; Impedance; Metallization; Polarization; Semiconductor thin films; Silicon; Sputtering; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium 1992. 30th Annual Proceedings., International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-0473-X
Type :
conf
DOI :
10.1109/RELPHY.1992.187652
Filename :
187652
Link To Document :
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