Title :
A test chip for automatic reliability measurements of interconnect vias
Author :
Lippe, K. ; Hasper, A. ; Elfrink, G.W. ; Niehof, J. ; Kerkhoff, H.G.
Author_Institution :
MESA Res. Inst., Enschede Univ., Netherlands
fDate :
March 31 1992-April 2 1992
Abstract :
A test circuit for electromigration reliability measurements was designed and tested. The device under test (DUT) is a via-hole chain. The test circuit permits simultaneous measurements of a number of DUTs, and a fatal error of one DUT does not influence the measurement results of the other DUTs. Measurements require only a few measurement instruments. Comparing the measurement results of a single DUT io the measurement results of the test circuit shows that the test circuit may be used for reliability measurements.<>
Keywords :
automatic test equipment; electromigration; metallisation; reliability; automatic reliability measurements; electromigration reliability measurements; few measurement instruments; interconnect vias; multilevel interconnects; simultaneous measurements; test chip; test circuit; via-hole chain; Automatic testing; Circuit testing; Current density; Current measurement; Electrical resistance measurement; Semiconductor device measurement; Stress measurement; Temperature; Voltage; Voltmeters;
Conference_Titel :
Reliability Physics Symposium 1992. 30th Annual Proceedings., International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-0473-X
DOI :
10.1109/RELPHY.1992.187653
