Title :
Acoustic evaluation of electronic plastic packages
Author :
Siettmann, James ; Dias, Rajen ; Fiebelkorn, Ken
Author_Institution :
Intel Corp., Chandler, AZ, USA
fDate :
March 31 1992-April 2 1992
Abstract :
Describe a technique of C-mode scanning acoustic microscope (CSAM) image acquisition. The role acoustic reflected wave analysis plays in the acquisition of CSAM images is considered. The effect that mold compound thickness and transducer choice have on the resolution of leadframe features in plastic packages is illustrated. Potential applications of acoustic reflected wave analysis are presented.<>
Keywords :
acoustic microscopy; acoustic transducers; packaging; C-mode scanning acoustic microscope; CSAM images; acoustic reflected wave analysis; electronic plastic packages; image acquisition; leadframe features; mold compound thickness; transducer choice; Acoustic materials; Acoustic pulses; Acoustic reflection; Acoustic transducers; Acoustic waves; Delamination; Electronics packaging; Focusing; Microscopy; Plastic packaging;
Conference_Titel :
Reliability Physics Symposium 1992. 30th Annual Proceedings., International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-0473-X
DOI :
10.1109/RELPHY.1992.187662
