DocumentCode

2923045

Title

Stress Characterization for Stress-Induced Voiding in Cu/Low K Interconnects with Geometry and Upper Cap Layer Dependences

Author

Lin, Mingte ; Liang, James W. ; Su, K.C.

Author_Institution

Reliability Technology and Assurance Div., United Microelectronics Corp., No. 3, Li-Hsin Rd. II, Science-Based Industrial Park, Hsin-Chu City, 30077, Taiwan.

fYear

2008

fDate

12-16 Oct. 2008

Firstpage

1

Lastpage

18

Keywords

Cities and towns; Geometry; Material properties; Microelectronics; Performance evaluation; Physics; Samarium; Testing; Thermal expansion; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Reliability Workshop Final Report, 2008. IRW 2008. IEEE International

Conference_Location

South lake Tahoe, CA, USA

ISSN

1930-8841

Print_ISBN

978-1-4244-2194-7

Electronic_ISBN

1930-8841

Type

conf

DOI

10.1109/IRWS.2008.4796126

Filename

4796126