DocumentCode :
2923106
Title :
30th Annual Proceedings. Reliability Physics 1992 (Cat. No.92CH3084-1)
fYear :
1992
fDate :
March 31 1992-April 2 1992
Keywords :
circuit reliability; dielectric thin films; failure analysis; hot carriers; integrated circuit technology; metallisation; packaging; reliability; semiconductor devices; semiconductor technology; dielectrics; failure analysis; hot carriers; metallization; packaging; reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium 1992. 30th Annual Proceedings., International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-0473-X
Type :
conf
DOI :
10.1109/RELPHY.1992.187677
Filename :
187677
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2923106
بازگشت