DocumentCode :
2923190
Title :
"Dual-function 3D heatsink antenna for high-density 3D integration"
Author :
Lin, Jenshan
Author_Institution :
University of Florida, USA
fYear :
2007
fDate :
9-11 Dec. 2007
Keywords :
Biographies; CMOS technology; Coupling circuits; Heat sinks; Integrated circuit interconnections; Integrated circuit technology; Optical transmitters; Radio frequency; Transmitting antennas; Wireless sensor networks;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radio-Frequency Integration Technology, 2007. RFIT 007. IEEE International Workshop on
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1307-2
Electronic_ISBN :
978-1-4244-1308-9
Type :
conf
DOI :
10.1109/RFIT.2007.4444006
Filename :
4444006
Link To Document :
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