DocumentCode
2923190
Title
"Dual-function 3D heatsink antenna for high-density 3D integration"
Author
Lin, Jenshan
Author_Institution
University of Florida, USA
fYear
2007
fDate
9-11 Dec. 2007
Keywords
Biographies; CMOS technology; Coupling circuits; Heat sinks; Integrated circuit interconnections; Integrated circuit technology; Optical transmitters; Radio frequency; Transmitting antennas; Wireless sensor networks;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio-Frequency Integration Technology, 2007. RFIT 007. IEEE International Workshop on
Conference_Location
Singapore
Print_ISBN
978-1-4244-1307-2
Electronic_ISBN
978-1-4244-1308-9
Type
conf
DOI
10.1109/RFIT.2007.4444006
Filename
4444006
Link To Document