DocumentCode :
2923265
Title :
Quantitative reliability assessment of Plasma Induced Damage on product wafers with fast WLR measurements
Author :
Martin, Andreas ; Bukethal, Christoph ; Rydén, Karl-Henrik ; Baier, Sascha ; Schwerd, Markus
fYear :
2008
fDate :
12-16 Oct. 2008
Firstpage :
1
Lastpage :
17
Keywords :
Current measurement; Degradation; Electron traps; Leakage current; Life testing; MOS devices; MOSFETs; Plasma measurements; Stress measurement; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2008. IRW 2008. IEEE International
Conference_Location :
South lake Tahoe, CA, USA
ISSN :
1930-8841
Print_ISBN :
978-1-4244-2194-7
Electronic_ISBN :
1930-8841
Type :
conf
DOI :
10.1109/IRWS.2008.4796138
Filename :
4796138
Link To Document :
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