Title :
"SiP vs SoC for mobile communications applications"
Author_Institution :
ST Crolles, Crolles
Abstract :
Summary form only given. Part of the challenge, when issuing transceiver chips for the telecommunication market today, is not only to make a consistent choice between a set standards, but also to choose the adequate technology, and integration flow. Depending on the standards characteristics and the proposed architecture the choice will lead either to system on chip SOC or to System on module solutions mostly called SIP.
Keywords :
mobile communication; system-in-package; system-on-chip; transceivers; SiP; SoC; mobile communications; system on module solutions; transceiver chips; Gallium arsenide; MMICs; Microwave devices; Mobile communication; Phase noise; Power amplifiers; Power generation; Radio frequency; Radiofrequency amplifiers; Transceivers;
Conference_Titel :
Radio-Frequency Integration Technology, 2007. RFIT 007. IEEE International Workshop on
Conference_Location :
Rasa Sentosa Resort
Print_ISBN :
978-1-4244-1307-2
Electronic_ISBN :
978-1-4244-1308-9
DOI :
10.1109/RFIT.2007.4444022
