Fabrication of high depth-to-width aspect ratio microstructures

Author

Engelmann, G. ; Ehrmann, O. ; Simon, J. ; Reichl, H.

Author_Institution

Technol. der Mikroperipherik, Tech. Univ. Berlin, Germany

fYear

1992

fDate

4-7 Feb 1992

Firstpage

93

Lastpage

98

Abstract

It is reported that a 3-D fabrication process, based on sputtering of a thin-film plating base, on conventional UV lithography, and on electrochemical deposition of gold, makes microstructures of considerable height and resolution possible. The thin-film formation and the lithographic process are outlined, particular attention being paid to layer deposition and structure printing. The present resolution limit is about 4.5 μm for a 30-μm-thick resist. Much thicker layers (80 μm) can be printed with reduced resolution. The results are discussed and process characteristics relevant in various applications are considered

Keywords

electric actuators; electric sensing devices; electroplating; metallisation; micromechanical devices; photolithography; photoresists; sputter etching; 3-D fabrication process; Au deposition; RIE; UV lithography; electrochemical deposition; high depth-to-width aspect ratio microstructures; interdigital capacitor; metallisation layers; microactuators; microsensors; sputtering; structure printing; thin-film plating base; Actuators; Etching; Fabrication; Gold; Lithography; Microstructure; Packaging; Resists; Semiconductor thin films; Sputtering;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1992, MEMS '92, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robot. IEEE

Conference_Location

Travemunde

Print_ISBN

0-7803-0497-7

Type

conf

DOI

10.1109/MEMSYS.1992.187697

Filename

187697