Title :
Polymer bonding of micro-machined silicon structures
Author :
Besten, C. Den ; van Hal, R.E.G. ; Munoz, J. ; Bergveld, P.
Author_Institution :
MESA Res. Inst., Twente Univ., Enschede, Netherlands
Abstract :
Polymer bonding is an indirect bonding technique that can be performed at temperatures of less than 150°C. Thin layers of negative photoresist polyimide and epoxy were used to bond micromachined test devices to other pieces of silicon. The strength of the resulting bond and the influence of primers like APS and HMDS on the bond strength were tested. The best results were achieved with negative photoresist without primer at a curing temperature of 130°C. The bond strength was more than 130 kg/cm2
Keywords :
adhesion; electric sensing devices; elemental semiconductors; micromechanical devices; photoresists; polymer films; silicon; wafer bonding; 130 C; Si; Si micromachined structures; bond strength; curing temperature; elemental semiconductor; epoxy; indirect bonding technique; influence of primers; micromachined test devices; microsensors; negative photoresist polyimide; polymer bonding; Bonding processes; Metallization; Polymers; Resists; Rough surfaces; Silicon; Surface roughness; Temperature sensors; Testing; Wafer bonding;
Conference_Titel :
Micro Electro Mechanical Systems, 1992, MEMS '92, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robot. IEEE
Conference_Location :
Travemunde
Print_ISBN :
0-7803-0497-7
DOI :
10.1109/MEMSYS.1992.187699
