DocumentCode
2923477
Title
Reliability for "future" devices
Author
Haensch, Wilfried
fYear
2008
fDate
12-16 Oct. 2008
Abstract
This article consists of a collection of slides from the author´s conference presentation. Some of the specific areas/topics discussed include: Scaling (Density & Materials); Si Devices (Planar Devices: Classical, Fully depleted), (Non planar Devices: Non-Si Devices: Ge & III/V, and 1D devices); and a Summary.
Keywords
Dielectric devices; Dielectric materials; Materials reliability; Photonic band gap; Scalability;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2008. IRW 2008. IEEE International
Conference_Location
S. Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4244-2194-7
Type
conf
DOI
10.1109/IRWS.2008.4796149
Filename
4796149
Link To Document