• DocumentCode
    2923477
  • Title

    Reliability for "future" devices

  • Author

    Haensch, Wilfried

  • fYear
    2008
  • fDate
    12-16 Oct. 2008
  • Abstract
    This article consists of a collection of slides from the author´s conference presentation. Some of the specific areas/topics discussed include: Scaling (Density & Materials); Si Devices (Planar Devices: Classical, Fully depleted), (Non planar Devices: Non-Si Devices: Ge & III/V, and 1D devices); and a Summary.
  • Keywords
    Dielectric devices; Dielectric materials; Materials reliability; Photonic band gap; Scalability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2008. IRW 2008. IEEE International
  • Conference_Location
    S. Lake Tahoe, CA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4244-2194-7
  • Type

    conf

  • DOI
    10.1109/IRWS.2008.4796149
  • Filename
    4796149