Integration of the anisotropic-silicon-etching program ASEP within the CAEMEMS CAD/CAE framework

Author

Buser, Rudolf A. ; Crary, Selden B. ; Juma, Omar S.

Author_Institution

Inst. of Microtechnol., Neuchatel Univ., Switzerland

fYear

1992

fDate

4-7 Feb 1992

Firstpage

133

Lastpage

139

Abstract

The authors describe the inclusion, within a microelectromechanical-system (MEMS)-specific computer-aided-design/computer-aided-engineering (CAD/CAE) framework, of a MEMS-related CAD tool that was developed independently of the framework. The tool, ASEP (anisotropic silicon etching program), simulates the etching of (100)-oriented silicon by aqueous solutions of KOH, based on user-specified mask and etch-depth information. The framework is CAEMEMS (computer-aided engineering of microelectromechanical systems), which is a developing UNIX- and Motif-based system for MEMS designers. The operation of the integrated software is demonstrated with the design of a torsional resonator

Keywords

CAD/CAM; electric actuators; electric sensing devices; electronic engineering computing; elemental semiconductors; etching; integrated software; micromechanical devices; semiconductor process modelling; silicon; ASEP program; CAD/CAE framework; CAEMEMS framework; KOH-H₂O solutions; Motif-based system; Si; UNIX-based system; anisotropic Si etching; computer-aided engineering; elemental semiconductor; integrated software; microelectromechanical systems; micromachining; torsional resonator; Anisotropic magnetoresistance; Computer aided engineering; Design automation; Etching; Mechanical engineering; Mechanical systems; Micromechanical devices; Process design; Silicon; Solid modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1992, MEMS '92, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robot. IEEE

Conference_Location

Travemunde

Print_ISBN

0-7803-0497-7

Type

conf

DOI

10.1109/MEMSYS.1992.187704

Filename

187704