DocumentCode
2923629
Title
Development of flip-chip 1300 nm VCSELs
Author
Louderback, Duane A. ; Stone, Richard V. ; Graham, Kati G. ; Guilfoyle, Peter S. ; Choquette, Kent D. ; Klem, John F. ; Serkland, Darwin K.
Volume
2
fYear
2002
fDate
10-14 Nov. 2002
Firstpage
691
Abstract
We present results on the development of monolithic 1300 nm VCSELs designed for flip-chip bonding. Nearly identical top- and bottom-emitting VCSEL structures were utilized to evaluate the performance of flip-chip VCSELs.
Keywords
flip-chip devices; laser transitions; semiconductor device packaging; surface emitting lasers; 1300 nm; bottom-emitting VCSEL structure; flip-chip bonding; monolithic 1300 nm VCSEL; performance; top-emitting VCSEL structure; Apertures; Bonding; High speed optical techniques; Laboratories; Manufacturing; Optical modulation; Optical transmitters; Power generation; Stimulated emission; Vertical cavity surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2002. LEOS 2002. The 15th Annual Meeting of the IEEE
ISSN
1092-8081
Print_ISBN
0-7803-7500-9
Type
conf
DOI
10.1109/LEOS.2002.1159494
Filename
1159494
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